Manufacturing method for bridge circuits
// Electronics and Electrotechnology // Material Technology // Measuring and Control Technology // Sensors and Measuring Instruments
Ref-Nr: 16551
Abstract
The invention concerns a procedure for the defined adjustment of sensor parameters. The deposition of the sensors takes place e.g. by means of cathode sputtering or chemical gas phase deposition e.g. directly on the technical surface of components. With this innovative process, the sensors can be specifically adjusted to a predefined characteristic value or, for example, directly calibrated during production.
Fig. 1: Functional model of a sensor full bridge
background
High demands are made on sensors with regard to homogeneity and manufacturing quality. In the field of temperature or strain measurement sensors, for example, compliance with defined resistance values is of great interest. This applies in particular to the interconnection of sensors in bridge circuits.
Innovation / Solution
Previously, sensors were set to the desired target value after the actual manufacturing process, a costly and time-consuming process. The technology of the invention includes that individual sensors or bridge circuits can be set to the desired final value during production. This is achieved by permanently monitoring the desired target value in combination with a trimming device during the manufacturing process.Benefits
High-precision manufacture of a complete bridge circuit with continuous quality control
Transferable to other manufacturing processes
Novel possibilities of sensor production, e.g. of completely trimmed and directly deposited sensor technology on technical surfaces
Retrofitting of existing production systems possible
fields of application
Sensor production, manufacture of bridge circuitsYou can close this window. You can find your search results in the previous window
